天蝎项目整机柜服务器解决方案
天蝎整机柜服务器技术规范
2.5
天蝎项目组 2014/8/29
天蝎整机柜服务器技术规范 2.5
文档版本修订记录
“天蝎技术规格2.5”修订记录
版本 draft
修订人
阿里巴巴、百度、腾讯、 中国电信、英特尔 阿里巴巴、百度、腾讯、 中国电信、英特尔
时间 2012.12.30
变更内容简述 汇总原始需求
和vendor讨论需求与部分 实现
完善各模块定义,及硬件 相关的技术细节 修订各模块定义,及完善 技术要求细节,统一术语 描述。
2014.08.29
审批发布
Rev 0.3 Rev 0.5
2013.06.28
阿里巴巴、百度、腾讯、 2013.11.08 中国电信、英特尔 阿里巴巴、百度、腾讯、
Rev 0.9 中国电信、中国移动、英 2014.08.19 特尔
Rev 1.0
开放数据中心决策委员 会
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天蝎整机柜服务器技术规范 2.5
目录
目录 ................................................................................................................................................................3 第一章 前言 ............................................................................................................................................5 1.1概述 .................................................................................................................................................5
1.2术语说明 .........................................................................................................................................6 第二章 机柜系统(Rack Subsystem)...................................................................................................7 2.1尺寸规格 .........................................................................................................................................7
2.2功能分区 .........................................................................................................................................7 2.3后部规格 .......................................................................................................................................10 2.4顶部规格 .......................................................................................................................................11 2.5底部规格 .......................................................................................................................................13 2.6承重设计 .......................................................................................................................................17 2.7并柜设计 .......................................................................................................................................17 2.8接地方式 .......................................................................................................................................18 2.9 Busbar及结构位置 ........................................................................................................................19 2.10电源框机构设计 .........................................................................................................................21 2.11 RMC机构设计..............................................................................................................................26 2.12风扇机构设计 .............................................................................................................................28 2.13机柜背板机构设计 .....................................................................................................................29 2.14服务器节点机构设计 .................................................................................................................29
2.14.1节点托盘背板机构 ..........................................................................................................29 2.14.2服务器定位及机柜背板定位设计...................................................................................32 2.14.3服务器止位设计 ..............................................................................................................35 2.14.4服务器固定孔设计 ..........................................................................................................37
第三章 网络系统(Network Subsystem) ..........................................................................................39 第四章 供电系统(Power Subsystem) ..............................................................................................39 4.1电源框(Power Shelf)......................................................................................................................39
4.2电源模块(PSU).........................................................................................................................41 4.3主铜排(Busbar) ........................................................................................................................45 4.4节点连接器(Clip) .....................................................................................................................47 第五章 散热系统(Cooling Subsystem) ............................................................................................47 5.1散热区域(Cooling Zone) ..........................................................................................................47
5.2风扇模组(Fan Tray) ..................................................................................................................48 5.3风扇盒(Fan Cage).....................................................................................................................48 5.4风扇(Fan)..................................................................................................................................48 5.5风扇背板(Fan Board) ...............................................................................................................50 5.6控制策略 .......................................................................................................................................51 第六章 机柜管理系统(RMC Subsystem).........................................................................................53
6.1系统组成 .......................................................................................................................................53
6.2系统拓扑图 ...................................................................................................................................53
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6.3管理系统功能 ...............................................................................................................................54
6.3.1节点监控 ............................................................................................................................54 6.3.2电源监控 ............................................................................................................................55 6.3.3风扇监控 ............................................................................................................................55 6.3.4通讯接口 ............................................................................................................................56 6.3.5 CLI命令规范........................................................................................................................56 6.3.6 IPMI命令规范.....................................................................................................................56 6.4 RMC单元........................................................................................................................................56
6.4.1尺寸 ....................................................................................................................................56 6.4.2硬件配置 ............................................................................................................................57 6.4.3散热 ....................................................................................................................................57 6.4.4连接电源框接口 ................................................................................................................57 6.4.5 PIN功能定义.......................................................................................................................58 6.5机柜背板(RBP)..........................................................................................................................62 6.6服务器托盘背板(TBP) .............................................................................................................64 6.7节点信号转接板(NSTB)...........................................................................................................65 6.8电源框背板(PBP) .....................................................................................................................65 第七章 服务器节点(Server Node) ..................................................................................................67 7.1服务器托盘(Server Tray)尺寸..................................................................................................67
7.2主板(Mother Board)尺寸.........................................................................................................67 7.3托盘背板(TBP) .........................................................................................................................68 7.4节点供电需求 ................................................................................................................................68 7.5面板规格 .......................................................................................................................................69 7.6指示灯功能定义 ...........................................................................................................................69 第八章 环境及机房要求 ......................................................................................................................70 8.1工作环境 ........................................................................................................................................70
8.2存储环境 .......................................................................................................................................70 8.3机房要求 .......................................................................................................................................70 第九章 电磁辐射 ..................................................................................................................................71 附录 ..............................................................................................................................................................72
附录 1服务器节点配置参考............................................................................................................72 附录 2 RMC软件 CLI命令规范........................................................................................................75 附录 3 RMC支持的 IPMI命令规范 .................................................................................................75 附录 4整机柜管理框架指南............................................................................................................75
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