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电子产品的机械可靠性分析

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Mechanical Reliability of Electronics

Tim PawlakR&D Fellow

1? 2016 ANSYS, Inc.July 26, 2017ANSYS Confidential

PCB Assembly Reliability Analysis

?PCB Assembly Failure Modes

?Challenges of modeling PCB Assemblies?ANSYS Mechanical Workflow?Trace Mapping

?Thermal Analysis –Joule Heating Hot Spot Detection?Solder Reflow –Board-Level Warpage Analysis?Vibration –Modal and Random Vibration Analyses?Automated Post-Processing

?Thermal Cycling -Solder Joint Fatigue

?Conclusion

2? 2016 ANSYS, Inc.July 26, 2017ANSYS Confidential

PCB Assembly Failures Modes

?Mechanical failure of PCB assemblies are primarily due to thermal and vibration issues.

ThermalVibrationHumidityDust

Electronics failure modes

US Air force Avionics Integrity Program

?As packages become thinner and boards become thicker, the risk of failure increases and becomes harder to predict using traditional design rules.

?ANSYS provides a full set of tools to model the entire PCB assembly efficiently. This

allows engineers to foresee issues during the design process.

3? 2016 ANSYS, Inc.July 26, 2017ANSYS Confidential

Challenges of Modeling PCB Assemblies

?Geometry complexity?PCB

?Electronics Components

?Complex material models for solder

PCB

?11 layers

?21,000 bodies

(including trace and via)

Anand’sViscoplasticitymodelR. Darveaux, “Effect of Simulation

Methodology on Solder Joint Crack Growth Correlation”, ECTC 2000

4

? 2016 ANSYS, Inc.

July 26, 2017

Electronics components?585 bodies

?324 solder bodies on one chip

Board design from:

https://kosagi.com/w/index.php?title=Kovan_Main_Pageopen hardware robotics platform

ANSYS Confidential

ANSYS Mechanical Workflow

Submodelof chip with solder balls

PCB assembly CAD

?PCB sliced so that each

layer is a separate body (for trace mapping)

Solder reflow warpage simulation

?With submodelingof crucial componentsOperating condition

thermal stress simulation with joule heating

Model and random vibration analysis

ODB++ layout file for trace mapping

5

? 2016 ANSYS, Inc.

July 26, 2017

Joule heating results from DCIR Simulation

ANSYS Confidential

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