安美特++电镀基础知识培训

FACTORS AFFECTING PLATING CURRENT影响电镀电流的因素?????

Hydrogen Liberation ( cathode )氢气释放（阴极）

Oxygen Liberation ( anode )氧气释放（阳极）Polarization极化

Concentration Polarization ( Diffusion )浓度极化（扩散）

Hydrogen Overvoltage氢过电位

POLARIZATION极化E = IR

E = Volts伏特( potential difference电位差)R = Resistance电阻( resistance of solution to the flow of current 溶液对电流的阻抗)

I = Current电流( flow of electricity电荷的移动)E = CURRENT电流(I) X RESISTANCE电阻(R)Ep = Change in potential difference due to Polarization from resistance. 由于电阻升高造成的极化,极化导致的电位差的改变.

POLARIZATION 极化EP= PolarizationEpER= EIICONCENTRATION POLARIZATION 浓度极化CONCENTRATION OF METAL IONS BUILD ON THE SURFACE OF THE ANODE 阳极表面的金属离子浓度

?CONCENTRATION OF THE METAL IONS DECREASE AT THE SURFACE OF THE CATHODE

阴极表面的金属离子浓度减少

?CHANGE IN ANODE AND CATHODE FILMS CAUSES POLARIZATION阳极和阴极膜层的改变导致了极化

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CONCENTRATION POLARIZATION 浓度极化ANODE阳极

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Ni ++

CATHODE 阴极+ ++ ++ ++ +

EFFECT 影响Agitation 打气Temperature 温度

Ions