15. Material List of Components for RoHs 15.1 Process for WEEE and Rohs requirement
(1) We are now in the process of evaluating/converting to lead-free components/products.
(2) We use Sn/Ag/Cu soldering surface. The surface of pb-free solder is more rough than we used before.
(3) Heat-resistance temp.:
Reflow : 250℃,30 seconds Max.;
Connector soldering wave or hand soldering: 320℃, 10 seconds max. (4) Temp. curve of reflow, max. Temp.: 235±5℃;
Recommended customer’s soldering temp. of connector: 280℃, 3 seconds.
(5) The LCD controller T6963c is not available now, Toshiba lead –free version will be in mass production in August.
(6) How to differentiate pb-free LCM from 2005/Apr to 2005/June, we will add a symbol ―#‖ at the
end of module’s part number. The symbol ―#‖ will be removed from 2005/7/1.
15.2 Consisting material of LCM Please refer to the summarization and supplement of test report as follows:
? PAGE 1/2: Item 1 ~ 12 are Common parts list of current LCM, basically used in standard reflective LCM products.
? PAGE 2/2: Item 13 ~ 23 are optional parts list according to customer’s requirement, ex.: backlight components such as CCFL B\\L , LED B\\L, EL .., ect., or cable connector. Please present this list to customer if these materials are used.
? Each test report is provided by notarization organization, authorized by material suppliers; the none-verified components had sent to notarization organization by Winstar. Quality and manufacturing process of all materials will be kept improving to achieve the requirement of decreasing/totally prohibiting the usage of toxic chemical substances.
Page 21 of 25 WS-EP-008 10(A)
LCM COMMON PARTS LIST NO. 1 2 3 4 5 6 7 8 9 10 11 12 Material Item PCB-FR4 PCB-GREEN Ink PCB-Plate Bezel Frame Plastic Frame LCD-Glass LCD-Polizer Zebra Connector Assembly Tape Assembly Type Mylar Solder Paste Packing Pb N.D. N.D. N.D. 77.3ppm 24.0ppm N.D. N.D. N.D. N.D. N.D. 66.7ppm ND<90.0ppm Cd N.D. N.D. N.D. N.D. 4.8ppm N.D. N.D. N.D. N.D. N.D. ND ND<75.0ppm Hg N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. Cr(6+) N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. PBDEs & PBBs N.D.<0.0005% － － － N.D. N.D. N.D. N.D. N.D. N.D. － － Controlled Material F<50.0ppm CL <1386.ppm Br<50.0ppm I<50.0abbr Sb<5.0ppm As<10.0ppm Ba<10.0ppm Se<5.0ppm As<12.9ppm Ba<14.5ppm Sb<5.0ppm Se<2.0ppm Sb<60ppm As<25ppm Ba<1000ppm Se<500ppm ND<60.0ppm ND<60.0ppm Note: 1. N.D. for Pb , Cd , Hg and Cr means under 2.0ppm. Page 1/2 2. N.D. for PBDEs and PBBs means under 0.0005%.
Page 22 of 25 WS-EP-008 10(A)
LCM COMMON PARTS LIST NO. 13 14 15 16 17 18 19 20 21 22 23 Material Item CCFL-Tube (with inside material) CCFL-Wire CCFL B/L- Diffusion sheet CCFL B/L-Light Guid CCFL Tube Cover LED B/L- Diffusion sheet LED B/L-Light Guide LED Lamp LED B/L Reflector EL B/L FFC Cable Wire Pb 131ppm 256ppm N.D. N.D. N.D. N.D. N.D. 149ppm N.D. N.D. N.D. Cd N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. Hg 3069ppm N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. Cr(6+) N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. PBDEs & PBBs ND<0.0005% N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. － Controled Material PBDE N.D. PBB N.D. As<0.001 Cr<0.012 Cu<0.02 Se<0.006 As<2.0ppm Cr<0.007 Cu<0.31 Se<0.003 Note: 1. N.D. for Pb , Cd , Hg and Cr means under 2.0ppm. Page 2/2 2. N.D. for PBDEs and PBBs means under 0.0005%.
Page 23 of 25 WS-EP-008 10(A)
winstar LCM Sample Estimate Feedback Sheet Module Number： Page: 1
1、Panel Specification： 1. Panel Type：
2. View Direction： 3. Numbers of Dots： 4. View Area： 5. Active Area： 7. Storage Temperature：
□ Pass □ Pass □ Pass □ Pass □ Pass □ Pass
□ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG ,
6. Operating Temperature： □ Pass
8. Others：
2、Mechanical Specification：
□ Pass 1. PCB Size：
2. Frame Size： 3. Materal of Frame： 4. Connector Position： 5. Fix Hole Position： 6. Backlight Position： 7. Thickness of PCB： 9. Height of Module： 10. Others：
□ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass
□ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG ,
□ NG , □ NG , □ NG , □ NG , □ NG ,
8. Height of Frame to PCB： □ Pass
3、Relative Hole Size：
1. Pitch of Connector： 3. Mounting Hole size： 4. Mounting Hole Type： 5. Others：
4、Backlight Specification： 1. B/L Type： 2. B/L Color：
4. B/L Driving Current： 5. Brightness of B/L： 6. B/L Solder Method： 7. Others：
Page 24 of 25 WS-EP-008 10(A)
2. Hole size of Connector： □ Pass
3. B/L Driving Voltage (Reference for LED Type)： □ Pass
＞＞ Go to page 2 ＜＜
winstar
Module Number： Page: 2
5、Electronic Characteristics of Module：
□ Pass 1. Input Voltage：
2. Supply Current： 4. Contrast for LCD： 5. B/L Driving Method： 6. Negative Voltage Output： 7. Interface Function： 8. LCD Uniformity： 9. ESD test： 10. Others：
□ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass □ Pass
3. Driving Voltage for LCD： □ Pass
□ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG , □ NG ,
6、Summary：
Sales signature：
Customer Signature： Date： / /
Page 25 of 25 WS-EP-008 10(A)
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