RoHS最新豁免清单,中英文对照
Lead as a coating material for the thermal conduction module C-ring12
导热模组C-ring中的涂层材料所使用的铅
Lead in white glasses used for optical applications光学应用的白色玻璃中的铅
Cadmium and lead in filter glasses and glasses used for reflectance standards
13(b)
滤光玻璃及反射标准用的玻璃所含的铅13(a)
Lead in solders consisting of more than two elements for the connection between the pins and the package of14micropro-processors with a lead content of more than 80 % and less than 85 % by weight用于引脚和封装后微处理器之间连接的焊锡,用于引脚和封装后微处理器之间连接的焊锡,若此焊锡为2种以上的元素组成,种以上的元素组成,则其含铅量可介于80%~85%.Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated15circuit flip chip packages
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用的铅Lead in linear incandescent lamps with silicate coated tubes16
线型钨丝灯中灯管若有涂布硅酸盐,线型钨丝灯中灯管若有涂布硅酸盐,则铅可豁免17
Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications用于专业复印设备的高强度放电灯(HID)中用作激发的卤素铅
之后豁免:2010/09/24前年投放在市场上的电子电机产品的备 豁免到期:2011/01/01
之后豁免:2010/09/24前年投放在市场上的电子电机产品的 豁免到期:2013/09/01
Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as specialitylamps for diazoprinting reprography, lithography, insect traps, photochemical and curing processes containing
18(a)phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb)
特殊用途的放电灯,特殊用途的放电灯,例如用于含二氮化合物的电子翻印、平板印刷、捕虫灯、光化学或树脂硬化过程,其中含有磷,其中含有磷,例如SMS ((Sr,Ba)2MgSi2O7:Pb) ,则放电灯中的荧光粉,其铅作为触发源,铅含量≤铅含量≤1%。18(b)
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