东芝电子可靠性测试(6)

东芝电子可靠性测试

1.3 Reliability Test Methods

Reliability test methods include TEG evaluation, in which special sets of devices (referred to as a test element group or TEG) are created for each failure cause, and product evaluation, whereby the product is comprehensively evaluated.

1.3.1 TEG Evaluation

TEG evaluation targets basic failure mechanisms. In this method, a set of devices is manufactured especially for the evaluation and analysis of each failure mechanism. The method allows detailed evaluation and failure analysis of failure mechanisms, and is very effective for quantifying limits and acceleration capabilities. Table 1.2 shows an example of TEG evaluation method.

Depending on the objective, TEG evaluation can be performed either by on wafer or an encapsulated packag. TEG evaluation has four major objectives:

(1) During DAT (design approval testing) of new technology and products, it is used tofind the method of elimination for failure mechanisms that affect reliability. The various kinds of TEG shown in Table 1.2 are used to evaluate failure mechanisms attributable to the process or the design.

(2) Clarify failure mechanisms involved in defects found during the product evaluation phase.

(3) For monitoring manufacturing process parameters, monitor process quality control items such as film thickness, film shape and contamination, and failure rates for each process and design rule.

(4) Develop TEG for each function block and estimate product reliability lifetime and failure rate from each TEG combination.

In this manner, the TEG can be used for various purposes to precisely obtain appropriate data.

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