东芝电子可靠性测试(11)

东芝电子可靠性测试

Table 1.4 Product Reliability Test Examples (2/2)

Type

Standards

Test

Description and Test Conditions

EIAJ ED-4701

MIL-STD-883IEC 60749

JESD22

Vibration test Evaluate resistance to the vibration applied during

transport and usage. The test includes variable and constant frequency vibration; normally variable is used.

Normal test conditions:

Constant frequency vibration: 60 ± 20 Hz, 200 m/s2 in three directions, 96 ± 8H in each

direction

Variable frequency vibration: 100 to 2000 Hz 200 m/s2 in three directions, four cycles per direction, four minutes per cycle

Mechanical Shock test

Evaluate resistance to the shock applied during transport and usage. Normal test conditions:

Depends on device structure. With resin molded devices, shock acceleration of 15,000 m/s2 is applied three times in each of four directions. Evaluate resistance to constant acceleration. Normal test conditions:

Depends on device structure. With resin molded devices, acceleration of 200,000 m/s2 is applied in six direction, each for one minute Evaluate whether or not the strength of the terminal area is sufficient for the force applied during installation and usage. Normal test conditions:

Suspend a prescribed load onto the tip of the lead to bend it 90° and back. Apply tensile force

in a direction parallel to the lead. The prescribed load varies according to device structure.

Solder- ability test

Evaluate terminal solderability. Normal test conditions:

Solder bath temperature: 230°C, Dipping time: 5 sec.

Solder bath temperature: 245°C, Dipping time: 3 sec. (lead-free solder)

Sealing test

Evaluate the airtightness of the seal. Use bubbles to detect large leaks. This test is suitable for metallic and ceramic packages.

Evaluate the resistance to corrosion in a salt atmosphere.

Normal test conditions:

35°C, 5% salt solution, 24 hours

Mechanical Tests

Constant

acceleration test

―

Terminal

strength test

Salt

atmosphere test

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