东芝电子可靠性测试
2. Accelerated Lifetime Tests
2.1 Purpose
With the ever-increasing requirements for part and device reliability, the need to evaluate product lifetime and failure rates quickly is now greater than ever. Reliability tests are conducted under test conditions that simulate potential stresses applied to semiconductor components. Depending on the situation, however, it may take an exceedingly long time until failure occurs or failure may not occur within the limited test time. Therefore, stresses beyond those of actual operating conditions are applied to devices to physically and/or chronologically accelerate causes of degradation. In this way, device lifetime and failure rates can be determined, and failure mechanisms can be analyzed. This type of test is referred to as an accelerated lifetime test. Such tests are used to shorten the evaluation period and analyze mechanisms in detail.
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