165-Bump BGA Pin Description
Symbol
Type
Description
A 0, A 1I Address field LSBs and Address Counter Preset Inputs
A I Address Inputs DQ A DQ
B DQ
C DQ
D I/O Data Input and Output pins
B A , B B , B
C , B D
I Byte Write Enable for DQ A , DQ B , DQ C , DQ D I/Os; active low
NC —No Connect
CK I Clock Input Signal; active high
BW I Byte Write—Writes all enabled bytes; active low GW I Global Write Enable—Writes all bytes; active low
E 1I Chip Enable; active low E 3I Chip Enable; active low E 2I Chip Enable; active high G I Output Enable; active low
ADV I Burst address counter advance enable; active l0w ADSC, ADSP
I Address Strobe (Processor, Cache Controller); active low
ZZ I Sleep mode control; active high FT I Flow Through or Pipeline mode; active low LBO I Linear Burst Order mode; active low
TMS I Scan Test Mode Select TDI I Scan Test Data In TDO O Scan Test Data Out TCK I Scan Test Clock MCL —Must Connect Low V DD I Core power supply V SS I I/O and Core Ground V DDQ
I
Output driver power supply
GS88118B(T/D)/GS88132B(T/D)/GS88136B(T/D)
Rev: 1.05 11/20059/39© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see .
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